Supermicro SSG-640SP-DE2CR90. Technical specifications

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Two dual-processor computing nodes (hot swappable ) in one chassis,shared access between nodes to a common pool of 90 drives.
This platform is supplied as a ready-made solution from SuperMicro.
Minimum configuration:
- 4 processors
- 4 memory modules
- 24 drives
Enterprise High Availability cluster solution, redundancy of all subsystems, hot swap and shared access to drives.
Possible applications:
- Processing of large data arrays and analytics
- High Performance Computing (HPC)
Artificial Intelligence and Machine Learning (AI/ML)
- Telecommunication and cloud services
- Financial analytics
- Working with medical image archives
- Data repository
- Server for 1C

Configurator

Please check availability

Platform characteristics SSG-640SP-DE2CR90

Characteristic	Description

Platform	Supermicro SSG-640SP-DE2CR90 Server Platform
Server Board	Super X12DSC-6 (in each node)
Server Chassis	SuperChassis CSV-947HTS-R2K63P
Form Factor	4U, rack mountable
Processor	In each node: 2 x 3rd Gen Intel Xeon Scalable processors with 205W max TDP (platform limit) Processor socket Socket-P4 (LGA 4189), Intel Ice Lake architecture (Gen3), 10 nm process technology ECC memory support, from 8 to 40 physical cores, operating frequency from 2.0 GHz to 3.6 GHz Up to 60 MB L3 cache per processor (1.5 MB per core), 1.25 MB L2 cache per core, 32 KB + 48 KB L1 cache per core Support for Intel Hyper-Threading technologies (2 threads per core), Intel Turbo Boost, AVX-512 (2 FMA) Interprocessor interface UPI 10.4 (2 links) or 11.2 GT/s (3 links),64 PCIe 4.0 lanes, DMI 3.0 (4 lines) DDR4-2667/2933/3200 MT/s memory support, up to 6 TB per CPU, 4 dual-channel memory controllers (IMC)
Chipset	In each node:Intel C621A Chipset, 20 PCIe 3.0 lanes, up to 14 SATA ports, 14 USB 2.0, 10 USB 3.0, management port
System Memory	In each node: Memory types: ECC DDR4 Registered DIMM (RDIMM), ECC DDR4 Load Reduced DIMM (LRDIMM), 3DS RDIMM, 3DS LRDIMM Support for Intel Optane persistent memory 200 series (PMem) Memory operating frequency 2667/2933/3200 MT/s depending on processor model Maximum capacity: for DRAM - 4 TB (16 x 256 GB), for DRAM + PMem - 6 TB (8 x 256 GB + 8 x 512 GB) Four dual-channel memory controllers per processor (8 channels per CPU), 16 DIMM slots (8 per CPU, 1 module per channel) Memory subsystem bandwidth 171/188/205 GB/s (2667/2933/3200 MT/s) per CPU
Network Controller	In each node:Integrated Intel X550 network controller, 2 x 10Gb Ethernet RJ-45 ports (connected to CPU#2) In each node: Dedicated management port RJ45 Dedicated IPMI LAN port
Expansion Slots	In each node: - 1 PCIe 4.0 x16/x16 Low Profile Half Length (LPHL) slot from CPU#1 - 1 PCIe 4.0 x16/x16 Low Profile Half Length (LPHL) slot from CPU#1 - 1 x PCIe 4.0 x16/x16 Low Profile Half Length (LPHL) slot from CPU#2 PCIe 3.0 x36 slot for SAS mezzanine module or bypass card
Disk Subsystem Controller	In each node: Integrated SATA controller, 4 ports 6Gb/s, RAID 0/1/10, 2 x 7-Pin SATA on motherboard with SATA DOM support 2 x M.2 PCIe 3.0 x2 2280/22100 storage slots with chipset connection (Boot RAID support via VMD key) For a primary 90-drive disk enclosure shared between both nodes, for each node: - SAS module 2 x LSI 3616, 16 internal SAS ports 12Gb/s, HBA Mode (JBOD)
Disk Subsystem	For each node: Up to 90 hot-swappable 3.5"/2.5" 12Gb/s SATA3/SAS3 HDD/SSD top-loading drives (shared access between nodes) 6 x 15 drive cages, 3 x Single Expander modules 2x 2.5" SATA3 6Gb/s Fixed Mount Drive Cage, 2x 7-Pin SATA Connectors (Connect to sSATA)
Additional Storage	For each node: up to two SATA DOM drives (connection to sSATA, support for Boot RAID 0/1) Up to two M.2 2280/22110 drives with PCIe 3.0 x2 interface (connected to the chipset, Boot RAID support via VMD key)
Optical Storage	No, only external via USB port
Interfaces	For each node: DB-15 video connector, rear panel 2 x 10 GbE RJ-45 network ports, rear panel RJ-45 management port, rear panel 2 USB 3.0 ports on the rear panel 1 serial port on rear panel
Video Adapter	For each node: Integrated graphics controller based on ASPEED AST2600 BMC
Computing Modules	Internode interfaces: High-performance NTB PCIe 3.0 x16 bridge - Ethernet 1Gb - IPMI to support high availability mode
Control Panel	For each node: Control buttons: Power, Reset LED indication: Power status, HDD activity, Network activity, System Information, Power fail
Management and Monitoring	For each node: Intelligent Platform Management Interface v.2.0 (IPMI 2.0) Virtual media over LAN, KVM-over-LAN, ASPEED AST2600 Base Management Controller (BMC) Monitoring voltages, temperatures, fan speeds
Supported Operating Systems	Current list
Power Unit	x Redundant Hot-Swap Power Supplies 2600W 80 Plus Titanium, PMBus
System Cooling	6 x 8cm dual-rotor hot-swappable, redundant rear panel system fans
Dimensions	Height 17.7 cm (4U), width 44.9 cm, depth 109.1 cm
Weight	68.0 kg, 108.9 kg per package
Power Supply Parameters	100-240 VAC, 12 A, 50-60 Hz
Operating Environment	Operating temperature from +10°C to +35°C Storage temperature from -40°C to +60°C Operating relative humidity from 8% to 90% Relative humidity during storage from 5% to 95%
Warranty	Standard 36 months warranty, service at the service center